The field of electronic packaging is moving towards the development of innovative methods for thermomechanical analysis and 3D integration. Researchers are exploring new approaches to analyze and optimize the thermal and mechanical behavior of electronic packaging structures, including the use of virtual element methods and cube packing techniques. These methods enable the efficient exploration of the 3D design space and provide reliable predictions of thermal and mechanical responses. Additionally, there is a growing focus on thermal-aware design planning and pin assignment-aware floorplanning to minimize lateral heat blockages and optimize layout quality. Notable papers in this area include: The virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features, which accurately captures stress concentrations at material interfaces. Piano, a floorplanning framework that simultaneously optimizes module placement and pin assignment under multiple constraints, achieving significant reductions in HPWL, feedthrough wirelength, and unplaced pins.