The field of AI and electronics is moving towards a more sustainable future, with a focus on reducing environmental impact and promoting eco-friendly practices. Researchers are exploring innovative approaches to reduce electronic waste, increase energy efficiency, and develop more sustainable materials. One notable trend is the development of solder-free circuit assembly methods, such as thermoforming and 3D printing with liquid metal conductors, which enable easy reuse and recycling of electronic components. Another area of research is the assessment of the ecological impact of AI, including the carbon footprint and water usage of large language models. Furthermore, there is a growing interest in developing sustainability-oriented evaluation metrics for recommender systems, which can help analyze the impact of these systems on environmental, social, and economic aspects. Noteworthy papers in this area include:

• ProForm, which introduces a thermoforming approach for solder-free circuit prototyping, enabling secure and reversible mounting of electronic components without the need for solder.
• DissolvPCB, which presents a fully recyclable electronic prototyping technique using 3D printing with liquid metal conductors and PVA substrates, allowing for easy recycling of printed circuit board assemblies.